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US 6,188,582 B1Granted
Flexible interconnection between integrated circuit chip and substrate or printed circuit board
OwnerGeoffrey Peterinventor
Life of this patent
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Abstract
A flexible integrated circuit mounting apparatus and method for mounting a chip on a printed circuit board directed to the reduction of stresses within the mounting or interconnection medium, caused principally by a mismatch of the coefficient of thermal expansion between the chip circuit and the printed circuit board, and thus reduction of the likelihood of interconnection failure between the chip and the particular surface or device to which an interconnection is made.
Claims15
An interconnection bundle for mounting a chip on a PCB to reduce stresses caused by thermal expansion mismatch between the chip and the PCB comprising:
- a. a bundle first and second end;
- fibers having fiber first and second ends further comprising a plurality of fibers;
- b. the plurality of fibers has a plurality of fibers first and second end;
- c. the bundle first end and plurality of fibers first end affixed by means to a chip, having a chip mounting surface, at the chip mounting surface;
- the bundle second end and plurality of fibers second end affixed by means to a PCB, having a PCB mounting surface, at the PCB mounting surface such that the plurality of fibers flexibly interconnecting the chip and PCB such that upon expansion or contraction of the chip relative to the PCB, said plurality of fibers flex to reduce stresses resulting from the expansion or contraction of the chip.
2 more elements
Dependencies are inferred from the claim text.