Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage

An assembly comprising:

• a printed wiring board (PWB);
• a pallet coupled to a bottom surface of the PWB, the pallet having a thickness and an opening having first and second portions;
• a metal insert having a thickness, a first portion that is coupled to the bottom surface of the PWB and a second portion that is slidably mounted to the pallet, the second portion being capable of movement, relative to the pallet, in a plane substantially parallel to the PWB, wherein the first portion of the insert has a length, and the second portion of the insert has a length that is greater than the first portion of the insert;
• and the first and second portions of the insert fit at least partially in the respective first and second portions of the opening in the pallet;
• and
• a transistor soldered to the metal insert.

A method for fabricating a printed wiring board (PWB) assembly comprising the steps of:

• coupling a pallet to a bottom surface of a PWB;
• coupling a first portion of a metal insert to the bottom surface of the PWB;
• and
• slidably mounting a second portion of the metal insert to the pallet.