Integrated circuit package with multiple heat dissipation paths
AssigneeIndustrial Technology Research Institute
InventorsPo-Yao Lin, Ching-Bai Hwang
Life of this patent
Estimating the term…
Abstract
An integrated circuit package has a printed circuit board, a die mounted on the printed circuit board, and a heat spreader attached to the printed circuit board to cover the die and contact with the backside of the die. The heat spreader is formed by a piece body and a plurality of supporting leads extended downward from the periphery of the piece body. The supporting leads of the heat spreader are attached to the printed circuit board by surface mounting technology. The piece body of the heat spreader abuts on the backside of the die so that heat from the die can be conducted both upward to the outer environment and downward to the printed circuit board through the heat spreader, thereby enhancing the heat dissipation efficiency.
Claims8
An integrated circuit package comprising:
- a printed circuit board;
- a die attached to the printed circuit board;
- and
- a heat spreader covering the die, the heat spreader contacting with backside of the die and being mounted to the printed circuit board;
- wherein the heat spreader is formed by a piece body and a plurality of supporting leads extended downward from a periphery of the piece body;
- the printed circuit board has a surface formed thereon a plurality of thermal pads disposed around the die;
- and
- the plurality of supporting leads of the heat spreader are secured to the plurality of thermal pads on the printed circuit board, respectively.
Dependencies are inferred from the claim text.