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US 6,188,461 B1Granted
Method for manufacturing a liquid crystal display utilizing an etching end point detection part in a non-display area of the substrate
AssigneeLG. Philips LCD Co., Ltd.
InventorKyo Ho Moon
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a device includes the steps of forming a layer on a substrate and patterning an etching end point detection area in the layer in accordance with a designed pattern including an etching end point detection part.
Claims11
A method for manufacturing a liquid crystal display device having a substrate separated into a display area and a non-display area, comprising the steps of:
- forming a first layer on the substrate;
- forming a second layer on the first layer and covering both the display area and the non-display area;
- coating a photoresist layer over the second layer;
- exposing the photoresist layer to an ultraviolet light using a mask having a predetermined pattern for forming a hole at the display area and an etching end point detection part at the non-display area;
- developing the photoresist layer to form a pattern layer having a first pattern at the display area and an etching end point detection part pattern at the non-display area in accordance with the mask;
- injecting all etchant that reacts with portions of the second layer that are exposed through the first pattern and the etching end point detection part pattern to commence a removal of these exposed portions of the second layer resulting in the generation of a reproducing gas;
- and
- automatically detecting an etching end point by detecting the amount of the reproducing gas generated at both the display area and the non-display area.
5 more elements
A method for manufacturing a device having a substrate separated into a first portion and a second portion, comprising the steps of:
- forming a first layer on the substrate;
- forming a second layer on the first layer and covering both the first and second portions;
- coating a photoresist layer over the second layer;
- exposing the photoresist layer to an ultraviolet light using a mask having a predetermined pattern for forming a hole at the first portion and an etching end point detection part at the second portion;
- developing the photoresist layer to form a pattern layer having a first pattern at the first portion and an etching end point detection part pattern at the second portion in accordance with the mask;
- injecting an etchant that reacts with portions of the second layer that are exposed through the first pattern and the etching end point detection part pattern to commence a removal of these exposed portions of the second layer resulting in the generation of a reproducing gas;
- automatically detecting an etching end point by detecting the amount of the reproducing gas generated at both the first portion and the second portion of the substrate;
- and
- cutting out the second portion of the substrate after the device manufacturing is completed so that only the first portion remains in the finished device.
6 more elements
Dependencies are inferred from the claim text.