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US 6,188,414 B1Granted
Inkjet printhead with preformed substrate
AssigneeHewlett-Packard Company
InventorsMarvin Glenn Wong, Melissa D. Boyd, Timothy E. Beerling
Life of this patent
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Abstract
A robust printhead is disclosed comprising a substrate, an ink flow channel formed in the substrate, a beveled die having disposed heater resistors and which is inserted into the substrate, a TAB circuit used to electrically couple the beveled die to the substrate, and an encapsulated upper surface. The encapsulant is disposed at least over the electrical coupling between the beveled die and the interconnect.
Claims22
A print cartridge comprising:
- an encapsulant;
- an interconnect circuit;
- a beveled die including a plurality of orifices for ejecting ink;
- and
- a substrate with an upper and lower surface and including a groove formed in said upper surface, said groove having a bottom surface configured for channeling ink to said beveled die, said beveled die being fluidically sealed to at least a portion of said bottom surface of said groove, said interconnect circuit being disposed on at least a portion of said upper surface and having an electrical coupling to said beveled die, said encapsulant being disposed at least over said electrical coupling between said beveled die and said interconnect circuit, said encapsulant being substantially coplanar with said upper surface of said beveled die.
2 more elements
A substrate for a print cartridge comprising:
- an upper surface having a groove formed therein, said groove is configured to receive a beveled die, said groove further comprising:
- a bottom surface upon which said bevel die is substantially affixed;
- and
- a trench though which ink is supplied to the bevel die, said trench being
- fluidically coupled to an ink reservoir, said substrate having an encapsulant formed on a portion of said upper surface, said encapsulant being substantially coplanar with an upper surface of said beveled die.
2 more elements
A method for making an inkjet printhead comprising the steps of:
- providing a substrate;
- forming a groove in an upper surface of said substrate;
- disposing a beveled die in said groove;
- fluidically coupling said beveled die to said substrate within said groove;
- disposing an interconnect circuit on an upper surface of said substrate and electrically coupling said beveled die to said interconnect circuit;
- and
- disposing an encapsulant at least over said beveled die and interconnect circuit.
4 more elements
Dependencies are inferred from the claim text.