Antenna signal conduit for different temperature and pressure environments
AssigneeInfrared Components Corporation
InventorThomas H. Clynne
Life of this patent
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Abstract
A frequency matched signal conduit apparatus wherein a micro-strip feed fabricated onto a material consistent with long vacuum life applications, such as ceramic or other crystalline materials, is used with a vacuum vessel signal interconnect, electrically connected to the micro-strip feed, comprising thermally resistive, electrically conductive material that provides high thermal isolation and low signal loss, for electrically connecting the micro-strip feed network to a device to be cooled.
Claims14
A signal conduit apparatus for carrying an electrical signal received at a first location having a first temperature, to a second location having a second temperature different from said first temperature with a minimal signal conduit heat transfer loss comprising:
- a dielectric support structure positioned in said second location;
- said dielectric support structure supporting a micro-strip signal feed and an electrical ground feed;
- a first thermally resistive, electrically conductive signal interconnect electrically connected to said micro-strip signal feed, and a second thermally resistive, electrically conductive signal interconnect electrically connected to said micro-strip electrical ground feed;
- said first and second thermally resistive, electrically conductive signal interconnects extending, respectively, from said micro-strip signal feed and said micro-strip electrical ground feed at said second location to said first location for coupling said electrical signal received at said first location to said second location for further processing with a minimal amount of heat transfer.
An electrical signal processor for processing an electrical signal received at a first location having a first temperature and a first pressure equal to a vacuum, or a partial vacuum, and said electrical signal processor coupling said received electrical signal to a second location remote from said first location and having a second temperature different from said first temperature and a pressure different from said first pressure comprising:
- a signal receiving antenna carried within a vacuum dewar at said first location having a first temperature and a first pressure equal to a vacuum, or a partial vacuum;
- a signal conduit including a crystalline dielectric support structure that has structural integrity in vacuum conditions carried within said vacuum dewar and coupled to said signal receiving antenna, and a micro-strip signal feed and an electrical ground feed carried within said vacuum dewar;
- said micro-strip signal feed and an electrical ground feed supported on said dielectric support structure;
- a first thermally resistive, electrically conductive signal interconnect electrically connected to said micro-strip signal feed, and a second thermally resistive, electrically conductive signal interconnect electrically connected to said micro-strip electrical ground feed;
- said first and second thermally resistive, electrically conductive signal interconnects extending, respectively, from said micro-strip signal feed and said micro-strip electrical ground feed carried within said vacuum dewar for coupling said electrical signal received by the antenna at said first location to said second location for further processing with a minimal amount of heat transfer,
- electrically conductive signal penetration means electrically connected to said micro-strip signal feed and passing from said vacuum dewar to said second location for accessing said signal by a device to which said signal is to be provided.
Dependencies are inferred from the claim text.