Temporary package, system, and method for testing semiconductor dice and chip scale packages

A temporary package for testing a semiconductor die or a semiconductor package comprising:

• a base adapted to retain the die or the package, the base comprising a plurality of terminal contacts and conductive traces in electrical communication with the terminal contacts;
• an interconnect on the base comprising a substrate, a plurality of first contacts on the substrate for electrically contacting a plurality of second contacts on the die or the package, a plurality of conductors on the substrate located on different planes, and a plurality of insulating layer on the substrate electrically isolating the conductors;
• and
• a tape comprising metal bumps bonded to the conductors on the interconnect and to the conductive traces on the base to establish electrical communication therebetween.

A temporary package for testing a semiconductor die or a semiconductor package having a plurality of bumps comprising:

• a base configured to retain the die or the package, the base comprising a plurality of terminal contacts connectable to test circuitry, and a plurality of conductive traces in electrical communication with the terminal contacts;
• an interconnect on the base comprising a substrate, a plurality of first contacts comprising indentations on the substrate and conductive layers on the indentations configured to retain and electrically contact the bumps, and a plurality of multi level conductors on the substrate in electrical communication with the first contacts and embedded in a plurality of insulating layers;
• and
• a tape bonded to the interconnect and to the base for electrically connecting the first contacts to the terminal contacts.

A method for testing a semiconductor die or a semiconductor package having bumped contacts comprising:

• providing a test circuitry;
• providing a temporary package for packaging the die or the package, the temporary package comprising a plurality of terminal contacts in electrical communication with a plurality of conductive traces;
• providing an interconnect comprising a substrate, a plurality of first contacts on the substrate, a plurality of multi level conductors embedded in a plurality of insulating layers on the substrate, the first contacts comprising indentations and conductive layers thereon configured to retain and electrically engage the bumped contacts;
• placing the interconnect on the temporary package and bonding a tape to the conductors and to the conductive traces to establish electrical communication therebetween;
• assembling the die or the package in the temporary package with the first contacts in electrical communication with the bumped contacts and the terminal contacts in electrical communication with the test circuitry;
• and
• applying test signals through the terminal contacts, the first contacts, and the bumped contacts to the die or the package.