Method for forming an interposer for making temporary contact with pads of a semiconductor chip
AssigneeInternational Business Machines Corporation
InventorAnthony Michael Palagonia
Life of this patent
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Abstract
An interposer for making a penetrating temporary contact between the contact pads of a chip having bumped or unbumped I/O pads and a test board for the purpose of testing said chip is disclosed. The interposer comprises a silicon substrate having sharp penetrating structures integrally formed at a predetermined depth in the silicon substrate along crystallographic planes. The resultant apparatus has a matching lateral thermal expansion to the chip being tested and provides uniform contact to all chip I/O pads.
Claims9
A method of fabricating an interposer for making temporary contact with contact pads of a semiconductor chip, comprising the steps of:
- etching a silicon substrate along crystallographic planes to form a plurality of V-groove regions with sharp ridges and troughs which interact with the contact pads, the regions having a predetermined depth and arranged on a surface of said silicon substrate in juxtaposition to the contact pads, the regions have a uniform geometry;
- forming a thin conformal insulator layer over said silicon substrate;
- and
- forming a plurality of electrically integral conductive lines having a first end conformally coating at least one region, a second end terminating in a pad arranged in at least one row at a periphery of said silicon substrate and a middle portion connecting said first and second ends.
Dependencies are inferred from the claim text.