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US 6,188,230 B1Granted
Pickup chuck for double sided contact
AssigneeIntel Corporation
InventorThomas J. Birk
Life of this patent
Estimating the term…
Abstract
A pickup chuck for retaining a semiconductor chip package having electrical contact pads on a surface thereof facing into the pickup chuck. The pickup chuck includes an electrically conductive member for coupling the contact pads to an external electrical device, such as a tester.
Claims10
A tester combination which includes:
- a pickup chuck defining a recess for receiving a semiconductor chip package, the semiconductor chip package comprising a first electrical contact on a surface thereof, the first electrical contact having a surface facing away from the recess;
- and a second electrical contact on a surface thereof, the second electrical contact having a surface facing into the recess;
- a contactor, which is disengageable from and engageable with the pickup chuck, having a third electrical contact and a fourth electrical contact positioned so that, when the contactor is engaged with the pickup chuck, the third and fourth electrical contacts are located on a side of the semiconductor chip package opposing the surface of the second electrical contact;
- and
- an electrically conductive element, wherein the surface of the first and third electrical contacts contact one another, and the element electrically connects the surface of the second and fourth electrical contacts with one another when the pickup chuck and the contactor are engaged with one another.
2 more elements
A tester combination which includes:
- a pickup chuck defining a recess for receiving a semiconductor chip package, the semiconductor chip package comprising a first electrical contact on a surface thereof, the first electrical contact having a surface facing away from the recess, and a second electrical contact on a surface thereof, the second electrical contact having a surface facing into the recess;
- a contactor, which is disengageable from and engageable with the pickup chuck, having a third electrical contact and a fourth electrical contact positioned so that, when the contactor is engaged with the pickup chuck, the third and fourth electrical contacts are located on a side of the semiconductor chip package opposing the surface of the second electrical contact;
- and
- an electrically conductive element, mounted to the pickup chuck such that movement of the pickup chuck and the contactor relative to one another from disengagement of the pickup chuck and the contactor from one another to engagement of the pickup chuck and the contactor with one another causes the surface of the first and third electrical contacts to contact one another, and the element to electrically connect the surface of the second and fourth electrical contacts with one another.
1 more element
Dependencies are inferred from the claim text.