Exposed heat spreader with seal ring
AssigneeAdvanced Technology Interconnect Incorporated
InventorsGerman Ramirez, Serafin Padilla Pedron, Jr.
Life of this patent
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Abstract
A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.
Claims8
A metal heat spreader useful in an encapsulated semiconductor package having at least one surface that will be exposed after encapsulation of the package and a raised seal ring around the perimeter of that surface.
A semiconductor package comprising:
- (a) at least one semiconductor device;
- (b) a heat spreader that has at lease one surface exposed to ambient and the perimeter of that exposed surface having a raised seal ring border;
- (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device;
- and
- (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.
Dependencies are inferred from the claim text.