Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer

A module of stackable semiconductor chips, comprising:

• a plurality of stackable semiconductor chips stacked one on top of another with double-sided adhesive disposed between said stackable semiconductor chips, each one of said stackable semiconductor chips including,
• a semiconductor chip having pads on an upper surface thereof,
• an adhesive formed on at least lateral surfaces of said semiconductor chip,
• a first insulation layer formed over said upper surface of said semiconductor chip and said adhesive, and defining a plurality of through holes which expose said pads,
• metal lines formed on said first insulation layer, each metal line connected to a respective one of said pads via a respective one of said through holes, and
• a protection layer formed on said metal lines and said first insulation layer;
• a plurality of external terminal pads formed on at least one lateral surface of said stack of stackable semiconductor chips, each one of said external terminal pads electrically connected to at least one of said metal lines in one of said stackable semiconductor chips;
• and
• a solder ball formed on each of said plurality of external terminal pads.