Semiconductor packing stack module and method of producing the same

A semiconductor package stack module comprising:

• a plurality of carriers stacked one upon the other, each of said plurality of carriers having first through holes associated with said carrier;
• a conductor pattern on at least a front face of said carrier and electrically connected to said first through holes;
• pads for inner bonding on a rear face of said carrier, and electrically connected to said first through holes;
• an LSI chip mounted face down on said carrier and connected thereto by said pads, said plurality of carriers being connected tridimensionally by said first through holes,
• wherein first said through holes are formed in said carriers, said plurality of carriers being electrically and tridimensionally connected to each other by bumps formed on said through holes;
• further comprising second through holes formed in fine pitch arrays in the edge of each of said carriers portions of said carrier;
• and
• said second through holes being connected to ground without exception.