Semiconductor photodetector packaging
AssigneeNortel Networks Limited
InventorJohn Kenneth Severn
Life of this patent
Estimating the term…
Abstract
A rear light entry photodetector chip is secured face-down with solder on to the front face of a ceramic submount provided with a pair of electrically conductive vias. A frame-shaped mass of solder seals the chip to the submount to provide a hermetic enclosure protecting sensitive semiconductor surface areas of the photodetector chip where electric fields are liable to be present in the vicinity of a pn or metal/semiconductor junction.
Claims4
A photodetector assembly including a rear light entry planar construction of semiconductor photodetector chip bonded face down upon a ceramic substrate so as to constitute a hermetic enclosure with opposed walls constituted respectively by the chip and the ceramic substrate.
Dependencies are inferred from the claim text.