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US 6,188,062 B1Granted
Laser/detector hybrid with integrated mirror and diffracted returned beam
AssigneeHoetron, Inc.
InventorWai-Hon Lee
Life of this patent
Estimating the term…
Abstract
The present laser/detector hybrid with a turning mirror integrated into the photo detector chip. This allows a smaller package for the device and a simpler method for producing the laser/detector device. The laser beam is emitted along the surface of the chip towards a groove cut in the chip. A mirror is mounted in the groove, and the mirror has a corrugated structure so that it will reflect the beam and convert it into multiple beams at the same time.
Claims12
An apparatus comprising:
- a semiconductor laser on a semiconductor chip, said laser emitting a laser beam along a plane parallel to a surface of said semiconductor chip;
- a groove in said chip in a direction of said laser beam from said semiconductor laser;
- a mirror mounted in said groove;
- and
- a corrugated structure on said mirror configured to split said laser beam into multiple beams.
2 more elements
An apparatus comprising:
- a semiconductor laser on a semiconductor chip, said laser emitting a laser beam along a plane parallel to a surface of said semiconductor chip;
- a groove in said chip in a direction of said laser beam from said semiconductor laser;
- a mirror bonded to a surface of said groove;
- a corrugated structure on said mirror configured to split said laser beam into multiple beams;
- a multiple element photodetector mounted on said chip adjacent said mirror at a position other than a position of said laser;
- and
- a detector element mounted behind said semiconductor laser positioned to detect a back emission of said semiconductor laser.
4 more elements
A method for manufacturing a laser/detector device comprising:
- forming a plurality of semiconductor lasers on a semiconductor wafer, said lasers being constructed to emit laser beams along a plane parallel to a surface of said semiconductor wafer;
- forming a plurality of grooves in said wafer in a direction of said laser beams from said semiconductor lasers;
- forming a plurality of multiple element photodetectors on said chip adjacent said grooves at a position other than a position of said lasers;
- forming a plurality of detector elements behind said semiconductor lasers positioned to detect a back emission of said semiconductor lasers;
- forming a corrugated structure on a plurality of mirrors such that an incident laser beam is split into multiple beams;
- bonding said mirrors to a surface of said grooves;
- and
- dicing said wafer into a plurality of chips.
5 more elements
Dependencies are inferred from the claim text.