Micromesh heating material and food packages made therefrom
AssigneeAdvanced Deposition Technologies, Inc.
InventorGlenn J. Walters
Life of this patent
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Abstract
A microwave heating material is formed of a micromesh conductive coating on a substrate. The micromesh includes a plurality of closely spaced, fine lines of a conductive material such as aluminum. The conductive material may have a resistivity of about 1-50 Ω/□. The microwave heating material may include electrically and physically discontinuous islands of micromesh, each of which may optionally be connected to another only by a susceptor fuse region. The microwave heating material is laminated to a supporting material which may be incorporated into wraps, bags, boxes, trays, and other food containers.
Claims25
A substrate heating material, comprising:
- a dielectric film substrate;
- and
- a lossy conductive high resolution micromesh of lines between 0.05″ and 0.005″ wide, separated by between 0.05″ and 0.005″ and supported by the dielectric film substrate.
A food package comprising:
- a dielectric film substrate;
- a susceptor region including a lossy conductor defining a high resolution micromesh pattern of lines between 0.05″ and 0.005″ wide, separated by between 0.05″ and 0.005″ and supported by the dielectric film substrate;
- and
- a food container to which the lossy conductor and substrate are laminated, the lossy conductor being disposed between a wall of the food container and the substrate.
Dependencies are inferred from the claim text.