Matrix-inductor soldering apparatus and device

A method for inductively soldering electronic components into a PCB, comprising the steps of:

• (a) placing electronic components over a PCB with adequate amount of solder material interposed between their leads and pads to be soldered producing a solderable PCB assembly, and
• (b) positioning said solderable PCB assembly on a matrix inductor in a predetermined relative position, said matrix inductor comprising a multiplicity of inductor cells, and
• (c) selectively supplying alternating currents to any of said multiplicity of inductor cells of said matrix inductor in a predetermined electrical connection for a predetermined time duration, in order to cause localized electromagnetic induction heating of the joints to be soldered
• whereby causing the joints to become soldered while the body of the electronic components and the dielectric material of the PCB and its interconnecting traces all remain relatively cold.

An apparatus primarily intended for inductively soldering electronic components to dissimilar PCBs, comprising:

• (a) a matrix inductor placed stationary against a PCB that includes a plurality of electronic components each component with several joints ready to be soldered, said matrix inductor comprising a multiplicity of inductor cells that are comparable in size to each of said several joints ready to be soldered, and
• (b) a radio-frequency generator having a power output, and
• (c) a switching device that connects said power output of said radio-frequency generator to a set of inductor cells conforming with a predetermined electrical connection specifically preselected for said PCB configuration, said set of inductor cells includes a few but not all of said multiplicity of inductor cells comprised into said matrix inductor, said predetermined electrical connection only permits to simultaneously generate localized heat for a predetermined time duration onto all of said several joints ready to be soldered by turning on-and-off said radio-frequency generator
• whereby said switching device facilitates a priori manual selection of said predetermined electrical connection so that in a single operation said plurality of electronic components are being simultaneously soldered while the body of each electronic component forming part of said plurality of electronic components and the dielectric material of said PCB and its interconnecting traces all remain relatively cold.

An apparatus primarily intended for inductively soldering electronic components to dissimilar PCBs in automated fashion, comprising:

• (a) a matrix inductor placed stationary against a PCB that includes a plurality of electronic components each component with several joints ready to be soldered, said matrix inductor comprising a multiplicity of inductor cells that are comparable in size to each of said several joints ready to be soldered, and
• (b) a radio-frequency generator having a power output, and
• (c) a switching device that connects said power output of said radio-frequency generator to a set of inductor cells conforming with a predetermined electrical connection cycle specifically preselected for said PCB configuration, said set of inductor cells includes a few but not all of said multiplicity of inductor cells comprised into said matrix inductor, and
• (d) a programmable controller that drives or instructs said switching device on how to connect said power output of said radio-frequency generator to said set of inductor cells in a predetermined electrical connection cycle, said predetermined electrical connection cycle permits to either simultaneously or sequentially connect each inductor cell forming part of said set of inductors cells for a predetermined individual time duration that accounts for the individual thermal-mass of each joint being soldered in order to only generate adequate localized heat onto all of said several joints ready to be soldered
• whereby said programmable controller automates the implementation of said predetermined electrical connection cycle so that in a single operation said plurality of electronic components are being either simultaneously or sequentially soldered while the body of each electronic component forming part of said plurality of electronic components and the dielectric material of said PCB and its interconnecting traces all remain relatively cold.