Adhesive for electronic parts and adhesive tape for electronic parts

An adhesive for electronic parts, comprising, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin, wherein at least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I), structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the following formula (I) and structural units represented by the following formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin,

• wherein W means a single bond, an alkylene group having 1 to 4 carbon atoms, —O—, —SO2— or —CO—, Ar1 denotes a divalent aromatic group represented by the following formula (1) or (2):
• in which X is a single bond, an alkylene group having 1 to 4 carbon atoms, —O—, —SO2— or —CO—, Y is an alkylene group having 1 to 4 carbon atoms, and Z1 and Z2 are each a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, Ar2 represents a divalent aromatic group having one or two hydroxyl groups or carboxyl groups, R1 and R6 individually mean an alkylene group having 1 to 4 carbon atoms or a group represented by the following formula (3):
• in which Alk is an alkylene group bonded to the silicon atoms in the Formula I and having 1 to 4 carbon atoms, R2 to R5 individually denote an alkylene group having 1 to 4 carbon atoms, and n stands for an integer of 1 to 32.