Process for underfill encapsulating flip chip driven by pressure

Abstract

The present invention provides a process for underfill encapsulating a flip chip which is driven by pressure. First, a metal foil is placed on a flip chip that has been connected to a substrate. Then, a downward pressure is applied to the metal foil so as to form a space among the metal foil, the flip chip, and the substrate. Then, an encapsulant is filled into the space under pressure. The chip on which the metal foil has been placed and that has been encapsulated is moved away. Then, another metal foil is placed on another flip chip that has been connected to the substrate to undergo the above-mentioned encapsulation process. Encapsulation of the next chip can begin without waiting the encapsulant packaging the prior chip to cure. Thus, the efficiency of the encapsulating machine can be greatly enhanced, and the conventional problems of encapsulant adhering to the mold can also be solved. After the encapsulant is cured, if the metal foil is left on the chip, the final chip package can achieve some special effects including heat dissipation, electromagnetic interference (EMI), and electric static discharge (ESD).

Dependencies are inferred from the claim text.