Flexible thin film ball grid array containing solder mask
AssigneeInternational Business Machines Corporation
InventorsGregg Joseph Armezzani, Robert Nicholas Ives, Mark Vincent Pierson, Terry Alan Tull
Life of this patent
Estimating the term…
Abstract
An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.
Claims10
A method for fabricating an electronic package which comprises the steps:
- a. providing a flexible film carrier having electronic circuitry on both a top surface and a bottom surface thereof and a plurality of solder interconnection pads on said top surface thereof;
- b. providing a solder mask layer on said top surface of said flexible film carrier and a second solder mask layer on said bottom surface of said flexible film carrier;
- c. aligning a plurality of modules having solder balls with corresponding solder interconnection pads on said top surface of said flexible film carrier, wherein said solder mask layer is not present on areas of said top surface located between adjacent individual modules;
- and
- d. subjecting said solder balls to reflow by heating to thereby attach said individual modules to said flexible carrier to thereby provide said electronic package.
Dependencies are inferred from the claim text.