Optical integrated circuit microbench system
AssigneeTRW Inc.
InventorsDean Tran, Eric R. Anderson, Ronald L. Strijek, Edward A. Rezek
Life of this patent
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Abstract
The invention relates to an optical integrated circuit microbench system for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials in two orthogonal directions. One etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is orthogonal provides a reflecting surface for directing the optical energy onto optical devices.
Claims15
A method for producing a monolitic optical microbench for the coupling of light between optical devices, said method comprising the steps of:
- providing a III-V semiconductor substrate wafer having a first surface, a second surface opposite the first surface, a first crystal plane, and a second crystal plane;
- lapping the entire first surface of the substrate wafer and polishing the entire first surface of the substrate wafer;
- coating a first layer of photoresist material over the entire first opposing surface of the substrate wafer and coating a second layer of photoresist material over the entire second opposing surface of the substrate wafer;
- baking first layer and the second layer of photoresist material at a temperature of substantially 150° C.;
- providing a first mask for the first opposing surface and a second mask for the second opposing surface of the substrate wafer;
- selectively aligning the fist mask to the it opposing surface and the second mask to the second opposing surface of the substrate wafer;
- exposing the first opposing surface of the substrate wafer coated with the first layer of photoresist material to a light source to form a first photoresist mask and exposing the second opposing surface of the substrate wafer coated with the second layer of photoresist material to a light source to form a second photoresist mask;
- developing the first opposing surface and the second opposing surface of the substrate wafer;
- etching the first opposing surface of the substrate wafer at a temperature substantially from 60° C. to 65° C. to form a curved reflective mirror;
- etching the second opposing surface of the substrate wafer to form a groove intersecting a plane of the curved reflective mirror;
- removing the first photoresist mask and cleaning the first opposing surface of the substrate wafer and removing the second photoresist mask and clang the second opposing surface of the substrate wafer;
- and
- metallizing the entire substrate wafer.
Dependencies are inferred from the claim text.