Multilayer ceramic substrate with anchored pad
AssigneeInternational Business Machines Corporation
InventorsBenjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal, Srinivasa S. N. Reddy, Rao V. Vallabhaneni
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Abstract
Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to an inner pad of the multilayer ceramic substrate by either a plurality of vias or one large via. The outer pad and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.
Claims35
A multilayer ceramic substrate with an anchored pad comprising:
- a first ceramic layer having a plurality of filled vias and an outer surface;
- at least one outer pad adjacent to the outer surface of the first ceramic layer, the at least one outer pad adhered to the plurality of filled vias in the first ceramic layer;
- a second ceramic layer adjacent to the first ceramic layer having at least one filled via in contact with at least one filled via of the first ceramic layer;
- and
- at least one inner pad interposed between the first and second ceramic layers and in contact with the plurality of filled vias in the first ceramic layer with each of the plurality of filled vias in the first ceramic layer being in contact with a via in the second ceramic layer or the inner pad.
A multilayer ceramic substrate with an anchored pad comprising:
- a first ceramic layer having a filled via and an outer surface;
- an outer pad adjacent to the outer surface of the first ceramic layer, the outer pad adhered to the filled via;
- a second ceramic layer adjacent to the first ceramic layer having at least one filled via in contact with the filled via of the first ceramic layer;
- an inner pad interposed between the first and second ceramic layers and in contact with the filled vias of the first and second layers;
- wherein the via in the first ceramic layer is larger in cross section than the via in the second ceramic layer and the first ceramic layer is thicker than the second ceramic layer.
A multilayer ceramic substrate with an anchored pad comprising:
- a first ceramic layer having a plurality of filled vias and an outer surface;
- a second ceramic layer adjacent to the first ceramic layer and having at least one filled via;
- at least one inner pad interposed between the first and second ceramic layers and in contact with the plurality of filled vias in the first ceramic layer and the at least one filled via in the second ceramic layer;
- a plurality of via columns extending from the outer surface of the first ceramic layer, the plurality of via columns being in contact with the plurality of filled vias of the first ceramic layer;
- and
- at least one pad adhered to the plurality of via columns.
A multilayer ceramic substrate with an anchored pad comprising:
- a ceramic layer having at least one filled via and an outer surface;
- an inner pad adhered to the outer surface of the ceramic layer and in contact with the at least one filled via in the first ceramic layer;
- a plurality of via columns extending from the inner pad;
- and
- an outer pad adhered to the plurality of via columns.
Dependencies are inferred from the claim text.