Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsTetsurou Satoh, Tsutomu Asai
Life of this patent
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Abstract
There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.
Claims15
A resin-coated copper foil obtained by coating a copper foil on one side with a resin composition as an interlaminar insulating resin for a multilayered printed circuit board, said resin composition comprising:
- (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefore,
- (b) a maleimide compound, and
- (c) a polyethersulfone resin polymerizable with the epoxy resin.
A multilayered copper-clad laminate which comprises an insulating base layer having two sides, an inner circuit formed on at least one side of the insulating base layer, a copper foil serving as a layer for an outer circuit, and an insulating layer disposed between said insulating base having an inner circuit formed thereon and said copper foil, characterized in that said insulating resin comprises:
- (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefore,
- (b) a maleimide compound, and
- (c) a polyethersulfone resin polymerizable with the epoxy resin.
A multilayered printed circuit board which comprises an insulating base layer having two sides, an inner circuit formed on at least one side of the insulating base layer, an outer circuit and an insulating layer disposed between said insulating base having an inner circuit formed thereon and said outer circuit, characterized in that said insulating resin layer comprises:
- (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefore,
- (b) a maleimide compound, and
- (c) a polyethersulfone resin polymerizable with the epoxy resin.
Dependencies are inferred from the claim text.