Integrated solution electroplating system and process
AssigneeTexas Instruments Incorporated
InventorsPaul R. Moehle, David M. Drew, Stephen J. Smith
Life of this patent
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Abstract
A method and system for electroplating a metal coating onto a continuous part, such as the leadframe stock used in packaging integrated circuits, whereby the method comprises plating metal from a series of plating baths having the same or compatible chemical composition, supplying a continuous electrical connection between the D.C. power supply via a rotating contact held in intimate contact with the cathode, and cooling the contact by using the plating solution itself.
Claims13
A system for electroplating a metal coating onto a continuous article which constitutes the cathode from a series of plating cells having the same or compatible plating solutions, wherein said system comprises:
- a continuous electrical connection between the D.C. power supply and said cathode via a rotating contact;
- and
- a contact cell wherein the rotating contact is cooled by the plating solution.
A system for electroplating a metal coating onto a continuous article which constitutes the cathode from a series of plating cells having the same or compatible plating solutions wherein said system comprises:
- a continuous electrical connection between the D.C. power supply and said cathode via a rotating contact;
- a contact cell wherein the rotating contact is cooled by the plating solution;
- a continuous electrical connection to the rotating contact is assured by a non-rotating electrical contact held in intimate contact by a system of weights, and
- a contact cell wherein the temperature of the rotating cathode contact is maintained at approximately the temperature of the plating bath.
A system for electroplating metal coatings onto lead frame stock material which constitutes the cathode from a series of plating cells having the same or compatible plating solutions, wherein the system comprises:
- a continuous electrical connection between the D.C. power supply and said cathode via a rotating contact;
- a contact cell wherein the rotating contact is cooled by the plating solution;
- a continuous electrical connection to the rotating contact is assured by a non-rotating electrical contact held in intimate contact by a system of weights;
- a contact cell wherein the temperature of the rotating cathode contact is maintained at approximately the temperature of the plating bath;
- a non-rotating contact is about 0.01 inches thick and about 0.5×1.5 inches, and
- a contact cell that is about 5 inches long, and the contact cells are placed about 50 inches apart.
A process for electroplating metal coating onto a continuous article from a series of plating baths having the same or compatible plating solutions comprising:
- immersing said article in plating solution, passing D.C. current to said article by way of a rotating contact maintained in continuous electrical contact by a non-rotating contact, cooling the contact by using plating solution, and
- transporting said article through each of the series of plating baths having the same composition using the same process for electrical contact and cooling.
Dependencies are inferred from the claim text.