Device for coating plate-shaped substrates
AssigneeLeybold Systems GmbH
InventorsManfred Schuhmacher, Andreas Sauer, Katja Grundmann
Life of this patent
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Abstract
A device for coating plate-shaped substrates by using cathode sputtering has several process chambers one after the other, each of which are bordered on the top by a chamber roof having in each case an opening. In this opening, which is covered at the top by a cathode arrangement, a frame is inserted. Screens and coolant lines of the process chamber are provided on the frame that can slide upwards out of the opening, projects into the process chamber, and is supported inside the opening of the chamber roof. A top of the cathode arrangement projects over the frame on the sides and is supported directly on the chamber roof so it seals it.
Claims11
A device for coating plate-shaped substrates by cathodic sputtering comprising:
- a plurality of process chambers provided one after the other wherein each process chamber is bordered by a chamber roof and has an opening that is covered by a top;
- at least one cathode to be sputtered provided in said opening;
- a frame that projects into said process chamber and slides out upward from said opening and that is supported with support parts on supporting surfaces of said chamber roof;
- and
- a plurality of screens and supply lines provided on said frame,
- wherein said top is provided over said support parts on said chamber roof to form a sealing means.
Dependencies are inferred from the claim text.