Die-bonding equipment and a method for detecting residual adhesive material using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSung-bok Hong, Yong-choul Lee, Yong-dae Ha, Young-gon Hwang
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Abstract
Die-bonding equipment and a method for detecting adhesive dotting on a substrate are disclosed. A dotted adhesive pattern illustrating an actually dotted state of the adhesive on a substrate is overlap-photographed with a standard pattern illustrating proper dotting pattern. The overlap-photographed pattern is compared with a standard overlap pattern. According to the compared result, whether the adhesive is properly dotted on the substrate is decided. When the adhesive is not properly dotted, an alarm signal is generated.
Claims23
Die-bonding equipment comprising:
- a dispenser for dotting an adhesive on a die pad of a substrate;
- and
- an adhesive detecting unit for detecting whether the adhesive is properly dotted on the die pad by forming an overlapped pattern of a dotted adhesive pattern of the adhesive and a standard pattern, and by comparing an overlapped pattern with a preset reference pattern.
A method for detecting an adhesive dotted on a substrate, the method comprising:
- measuring a pattern of the adhesive on the substrate;
- forming an overlapped pattern which includes a standard pattern overlapped with the pattern of the adhesive on the substrate;
- comparing the overlapped pattern to a reference overlapped pattern representing a overlapped pattern of the standard pattern and a properly dotted adhesive pattern;
- determining from the comparison whether the adhesive is properly dotted;
- and
- generating an alarm signal in response to determining that the adhesive is not properly dotted.
Dependencies are inferred from the claim text.