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US 6,187,093 B1Granted
Apparatus and method for planarization of spin-on materials
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorJia Zhen Zheng
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Abstract
An improved and new apparatus and process for planarization of spin-on materials has been developed. The key features of the apparatus and the process are an enclosure surrounding the spin-on table and substrate and the application of a planarization pressure plate to the substrate, subsequent to dispersal of the spin-on materials and during rotation of the substrate.
Claims8
An apparatus for applying spin-on material to a wafer substrate comprising:
- a spin-on-glass coater spin table with means for holding a wafer substrate onto said spin-on-glass coater spin table;
- a means of dispensing spin-on material onto said wafer substrate;
- a means for bringing a plate into symmetrically balanced contact with said wafer substrate during rotation of said wafer substrate;
- a means of applying a pressure force between said plate and said wafer substrate during rotation of said wafer substrate;
- a means of controlling the rotary speed of said spin-on-glass coater spin table;
- a means of controlling the pressure force between said plate and said wafer substrate during rotation of said wafer substrate;
- and
- an enclosure comprising a cup and moveable lid assembly which completely cover said spin-on-glass coater spin table.
5 more elements
Dependencies are inferred from the claim text.