Method and apparatus for controlling the thickness of a gate oxide in a semiconductor manufacturing process
AssigneeAdvanced Micro Devices, Inc.
InventorDonald L. Wollesen
Life of this patent
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Abstract
A method and apparatus for controlling the growth of an oxide, such as a gate oxide, in a semiconductor device manufacturing process takes into consideration the ambient atmospheric pressure in order to reduce the variance in gate oxide thicknesses between wafer lots. The pressure in the oxide diffusion tube is maintained at a constant pressure near the ambient atmospheric pressure during the oxide diffusion process. Alternatively, the furnace time is changed from lot to lot as a function of changes in the ambient atmospheric pressure in order to maintain the gate oxide thickness at a constant value between wafer lots.
Claims4
An arrangement for controllably growing an oxide layer on an object in a semiconductor device manufacturing process, comprising:
- an oxide diffusion tube;
- an ambient pressure monitor that determines an ambient atmospheric pressure;
- a heater in thermal contact with the oxide diffusion tube to controllably heat the oxide diffusion tube;
- a control arrangement coupled to the ambient pressure monitor and to the heater, the control arrangement controlling the heater to heat the oxide diffusion tube for an amount of time that is a function of the determined ambient atmospheric pressure.
Dependencies are inferred from the claim text.