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AssigneeUnited Microelectronics Corp.
InventorsChung Ping-Chung, Lu Tsung-Lin, Chi-Hsien Chen, Jing-Yi Huang, Ju-Long Lee, Hunter Chung, Chien-Feng Chen
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An exhaust gas treatment apparatus for treating exhaust gas generated in semiconductor manufacturing processes. It includes a main pipe, a gas vortex means, a water vortex means, an U pipe and a discharge pipe. The main pipe transforms the exhaust gases to waste powder which are discharged out through the U pipe and the discharge pipe. The gas vortex means and water vortex means are located below the main pipe for generating annular and even downward gas flow and water flow at the outlet of the main pipe for preventing reflux of waste powder from entering into the main pipe. Waste powder thus won't deposit around the outlet. Scraper in the main pipe won't be stuck or deformed. Waste powder may be discharged out through the U pipe and discharge pipe smoothly and efficiently.
An exhaust gas treatment apparatus including a water vortex means and a discharge pipe for treating exhaust gas generated in diffusion and deposition steps in wafer production processes, comprising:
An exhaust gas treatment apparatus including a water vortex means for treating exhaust gas generated in diffusion and deposition steps in wafer production processes, comprising:
An exhaust gas treatment apparatus including a discharge pipe for treating exhaust gas generated in diffusion and deposition steps in wafer production processes, comprising:
Dependencies are inferred from the claim text.