Chamber apparatus for processing semiconductor devices
AssigneeFujitsu Limited
InventorHidenobu Shirai
Life of this patent
Estimating the term…
Abstract
An apparatus suitable for producing semiconductors. The apparatus includes a processing chamber, a first preparatory chamber, and a second preparatory chamber. Workpieces are transferred to the processing chamber for processing in a vacuum. The first and second preparatory chambers are used for transferring the workpiece between the processing chamber and an exterior exposed to atmospheric pressure without exposing the processing chamber to the atmospheric pressure. The first and second preparatory chambers are aligned vertically, which reduces the floor space occupied by the apparatus.
Claims18
An apparatus for handling wafer-like workpieces, wherein the apparatus comprises:
- a processing chamber to which a workpiece is transferred and for performing a predetermined process on the workpiece;
- a first preparatory chamber and a second preparatory chamber for transferring the workpiece between the processing chamber and an exterior, wherein the first and second preparatory chambers are aligned vertically;
- a handling chamber connected to the processing chamber;
- a transfer chamber connected to the handling chamber, said transfer chamber having an upper side and a lower side, the first preparatory chamber being connected to the upper side of the transfer chamber and the second preparatory chamber being connected to the lower side of the transfer chamber;
- transfer means disposed in the handling chamber for transferring the workpieces between the processing chamber and the transfer chamber;
- an upper stage located in the transfer chamber to hold and transfer the workpieces between the first preparatory chamber and the transfer chamber;
- a lower stage located in the transfer chamber to hold and transfer the workpiece between the second preparatory chamber and the transfer chamber;
- and
- a substantially horizontally arranged movable upper cover for selectively communicating and disconnecting the exterior with the first preparatory chamber and a substantially horizontally arranged movable lower cover for selectively communicating and disconnecting the exterior with the second preparatory chamber.
An apparatus for handling semiconductor wafers, wherein the apparatus comprises:
- a processing chamber to which a wafer is transferred and for performing a predetermined process on the wafer in a vacuum;
- a vacuum chamber, which is maintained at a controlled level of vacuum, laterally connected to the processing chamber;
- a transfer chamber, which is maintained at a controlled level of vacuum, laterally connected to the vacuum chamber, the transfer chamber having an upper side and a lower side;
- a transfer member disposed in the handling chamber for transferring the workpieces between the processing chamber and the transfer chamber;
- a first preparatory chamber connected to the upper side of the transfer chamber;
- a second preparatory chamber aligned vertically with the first preparatory chamber and connected to the lower side of the transfer chamber, wherein the first and second preparatory chambers are constructed to permit transfer of a wafer between the processing chamber and an exterior exposed to atmospheric pressure without exposing the interior of the transfer chamber to the atmospheric pressure;
- and
- a substantially horizontally arranged movable upper cover for selectively communicating and disconnecting the exterior with the first preparatory chamber and a substantially horizontally arranged movable lower cover for selectively communicating and disconnecting the exterior with the second preparatory chamber.
Dependencies are inferred from the claim text.