Film support and circuit board assemblage for camera
AssigneeEastman Kodak Company
InventorDennis R. Zander
Life of this patent
Estimating the term…
Abstract
A film support and circuit board assemblage for a camera includes a film support which has a group of film supporting projections that each project an identical height from a film facing side of the film support, and a circuit board which has a raised part. The film support has a film supporting projection that projects from the film facing side the same height as the group of film supporting projections and that is hollow to form an open cavity in an opposite side of the film support. The circuit board is arranged next to the opposite side of the film support, with the raised part protruding into the cavity to make the camera compact.
Claims8
A film support and circuit board assemblage for a camera comprising a film support which has a group of film supporting projections that each project an identical height from a film facing side of said film support, and a circuit board which has a raised part, is characterized in that:
- said film support has a film supporting projection that projects from said film facing side the same height as said group of film supporting projections and that is hollow to form an open cavity in an opposite side of said film support;
- and
- said circuit board is arranged next to said opposite side of said film support, with said raised part protruding into said cavity.
A film support for a camera comprising a film facing side and an opposite side, and a group of film supporting projections that each project an identical height from said film facing side, is characterized in that:
- a film supporting projection projects from said film facing side the same height as said group of film supporting projections and is hollow to form an open cavity in an opposite side of said film support in order to receive a raised part of a circuit board when the circuit board is arranged next to said opposite side of said film support.
A camera comprising a main body part which has a backframe opening for film exposure, a film support which has a group of film supporting projections that each project an identical height from a film facing side of said film support, and a circuit board which has a raised part, is characterized in that:
- said film support has a film supporting projection that projects from said film facing side the same height as said group of film supporting projections and that is hollow to form an open cavity in an opposite side of said film support;
- and
- said circuit board is arranged next to said opposite side of said film support, with said raised part protruding into said cavity to make said camera compact.
A method of assembling a film support which has a group of film supporting projections that each project an identical height from a film facing side of the film support and which has a film supporting projection that projects from the film facing side the same height as the group of film supporting projections and that is hollow to form an open cavity in an opposite side of the film support, and a circuit board which has a raised part, said method comprises the steps of:
- arranging the circuit board next to the opposite side of the film support, and simultaneously inserting the raised part into the cavity.
Dependencies are inferred from the claim text.