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US 6,186,674 B1Granted
Optical sub-assembly package mount
AssigneeLucent Technologies Inc.
InventorNagesh R. Basavanhally
Life of this patent
Estimating the term…
Abstract
Compliant, resilient mounting means are provided for minimizing stresses on the platform of an optical sub-assembly package that tend to be caused by such factors as the mounting of the package base to a rigid, external platform, as by bolting, so as to maintain good alignment between the laser beam emitted from a laser chip mounted on the platform and the lens of an optical fiber also mounted on the platform.
Claims19
An optical sub-assembly package comprising:
- (A) a package base having a top wall, a bottom wall and side walls between said top and bottom walls, said walls having upper and lower horizontal surfaces;
- (B) a sub-assembly platform mounted to said top wall of said package base;
- (C) a light emitting laser chip;
- (D) an optical fiber assembly including an optical fiber lens for receiving light from said light emitting laser chip;
- (E) said light emitting laser chip and said optical fiber assembly being mounted on said platform in such manner as to provide proper alignment therebetween so as to maximize light from said chip that impinges on said lens;
- (F) at least one mounting flange extending outwardly from said lower horizontal surface of said bottom wall of said base for mounting said base to an external housing;
- and
- (G) a cut-out in said bottom wall adjacent said flanges for providing resiliency to said sub assembly so as to maintain said proper alignment between said light emitting chip and said fiber assembly.
5 more elements
Dependencies are inferred from the claim text.