Package for optical semiconductor module
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasanori Iida, Hiroyuki Asakura, Masaki Kobayashi
Life of this patent
Estimating the term…
Abstract
In a package mounting an optical semiconductor module, an optical semiconductor module is supported by a supporter fixed on a metallic base such that the optical semiconductor module is inclined relative to the circuit board. Further, a lead pin of the optical semiconductor module is set as high as a signal input/output line of a high frequency circuit board. The lead pin is fixed at the shortest distance to the signal input/output line with solder. Thus, the performance of the optical semiconductor module is not deteriorated, and the other components on the circuit board are not affected. A circuit board may be arranged below the optical semiconductor module.
Claims20
A package for an optical semiconductor module, said package comprising:
- a base;
- a circuit board fixed on an upper surface of said base and having a signal input/output line formed thereon;
- an optical semiconductor module disposed on an opposite side of said circuit board relative to said base, said optical semiconductor module having an input/output pin positioned so as to coincide with the signal input/output line formed on said circuit board, the input/output pin of said optical semiconductor module being connected electrically to the signal input/output line of said circuit board;
- and
- an optical fiber connected to said optical semiconductor module at a position different from the input/output pin of said optical semiconductor module,
- wherein said optical fiber is positioned at a level that is higher than electronic parts fixed to said circuit board.
A package for an optical semiconductor module, said package comprising:
- a base;
- a circuit board fixed to said base;
- and
- an optical semiconductor module connected electrically to said circuit board, wherein a longitudinal direction of said optical semiconductor module is oblique relative to said circuit board.
A package for optical semiconductor module, said package comprising:
- a base;
- an optical semiconductor module;
- a circuit board fixed to said base and connected electrically to said optical semiconductor module, which is positioned on an opposite side of said circuit board relative to said base;
- and
- an optical fiber connected to said optical semiconductor module at a position that is different from said input/output pin of said optical semiconductor module,
- wherein said circuit board extends below said optical semiconductor module, and said optical semiconductor module and said optical fiber are positioned so that electronic parts can be fixed to said circuit board under said optical semiconductor module and said optical fiber.
Dependencies are inferred from the claim text.