Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites on the component;
• providing a plurality of balls comprising a ferromagnetic material;
• providing a holder comprising a plurality of magnets configured to direct magnetic forces through the bonding sites to the balls, the holder configured to hold the component and to align the bonding sites to the magnets;
• aligning the balls to the bonding sites using the magnets;
• and
• bonding the balls to the bonding sites.

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites on the component;
• providing a plurality of balls, each ball comprising a plurality of ferromagnetic particles embedded in a polymer matrix;
• providing a plurality of magnets configured to direct magnetic forces through the bonding sites to the balls;
• aligning the balls to the bonding sites using the magnets;
• and
• bonding the balls to the bonding sites.

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites on the component having a first pattern;
• providing a plurality of balls comprising a ferromagnetic material;
• providing a plurality of magnets having a second pattern matching the first pattern and configured to align the balls to the bonding sites;
• providing a holder with the magnets thereon configured to hold the component with the bonding sites in alignment with the magnets;
• aligning the balls to the bonding sites using the magnets and the holder;
• and
• bonding the balls to the bonding sites.

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites in a first pattern on the component;
• providing a plurality of balls comprising a ferromagnetic material;
• providing a holder comprising a plurality of magnets having a second pattern matching the first pattern, the holder configured to hold the semiconductor component and to align the bonding sites to the magnets;
• aligning the balls to the bonding sites by placing the component in the holder and applying magnetic forces through the bonding sites to the balls using the magnets;
• holding the balls on the bonding sites using the magnets;
• and
• bonding the balls to the bonding sites.

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites in a first pattern on the component;
• providing a plurality of balls configured for bonding to the bonding sites and comprising a ferromagnetic material;
• providing a holder configured to hold the component and comprising magnets having a second pattern matching the first pattern;
• placing the component on the holder with the magnets aligned with the bonding sites;
• applying magnetic forces through component to the
• bonding sites to align and hold the balls on the bonding sites;
• and
• bonding the balls to the bonding sites.

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites on the semiconductor component in a first pattern;
• providing a plurality of balls comprising a polymer and a plurality of ferromagnetic particles embedded in the polymer;
• providing a plurality of magnets in a second pattern matching the first pattern and configured to align the balls to the bonding sites;
• aligning the balls to the bonding sites using the magnets;
• and
• bonding the balls to the bonding sites.

A method for forming contacts on a semiconductor component comprising:

• providing a plurality of bonding sites on the semiconductor component;
• providing a plurality of balls comprising a ferromagnetic material;
• providing a plurality of magnets configured to direct magnetic forces on the balls;
• aligning the balls to the bonding sites by moving the balls proximate to the magnets and adjusting the magnetic forces;
• and
• bonding the balls to the bonding sites.