Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems

Abstract

The invention concerns a process for precise electrolytic precipitation and etching of metals up to the marginal area of printed-circuit board and printed-circuit film panel in a continuous-cycle plant. In continuous-cycle plants, the panels are grasped by clips at least at one edge. The clips are used for current supply to the panels and, if necessary, for transporting the latter. Among other factors, owing to the shielding effect of the clips there are great plate thickness differences in the marginal area of the panels. This marginal area cannot be used for precise printed-circuit boards. The invention improves the plate thickness distribution in this marginal area by separating the plant into several partial plants and a defined offset V of the clip gripping points from plant part to plant part. The offset is preferably adjusted to values corresponding to the quotient of the clip distance T and the number of subsequently arranged plant parts. The distance is kept constant by electrical or by mechanical measures.

Dependencies are inferred from the claim text.