Jet soldering system and method
AssigneeRapid Analysis Development Company
InventorsMelissa E. Orme-Marmarelis, Eric Phillip Muntz, Gerald C. Pham-Van-Diep, Robert F. Smith, Jr.
Life of this patent
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Abstract
An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.
Claims24
An apparatus for filling filtered solder into one or more replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which one or more electronic components are to be mounted, the apparatus comprising
- a cartridge support bearing one or more replaceable solder cartridges,
- an environmentally-controlled chamber having an interior constructed and arranged to receive the cartridge support, with one or more solder cartridges thereon, and having a housing for shielding the interior of the chamber from external solder-oxidizing gases,
- a solder receptacle for containing molten solder to be supplied to the environmentally-controlled chamber for filling the one or more solder cartridges therein,
- a heater disposed in the vicinity of the receptacle and constructed and arranged to heat solder contained inside the solder receptacle to a temperature at or above the melting temperature of solder to produce molten solder, a molten solder flow conduit connected between the solder receptacle and said environmentally controlled chamber, and
- a separator to remove particulates and other debris from said molten solder after heating in said receptacle and prior to delivery to said one or more solder cartridges.
A method for providing solder cartridges filled with solder, the method comprising the steps of:
- supporting said one or more replaceable solder cartridges inside an environmentally-controlled chamber protected from external solder-oxidizing gases,
- heating a supply of solder to a temperature at or above the melting temperature of solder to produce molten solder,
- separating particulates and other debris from molten solder produced by the heating step,
- filling molten solder into one or more replaceable solder cartridges, and
- solidifying said solder in said one or more replaceable solder cartridges.
Dependencies are inferred from the claim text.