Semiconductor pressure sensor for sensing fluid pressure

A pressure sensor comprising:

• a housing made of metal material, said housing defining an inner area of said pressure sensor;
• a pressure sensing element mounted on a semiconductor board positioned in said inner area of said housing for sensing pressure,
• a pressure sensing element mounting member having an opening;
• a stem connecting member having an opening;
• and
• a stem having an opening,
• wherein said housing comprises:
• a liquid induction portion having a liquid induction hole, said liquid induction hole having an opening in said inner area of said housing;
• and
• an annular protrusion formed on said housing surrounding a periphery of said opening of said liquid induction hole,
• wherein said pressure sensing element is fixed airtightly to pressure sensing element mounting member,
• said pressure sensing element mounting member and said stem are fixed airtightly through said stem connecting member,
• said stem is fixed airtightly on a top surface of said protrusion of the housing, and said opening of said pressure sensing element mounting member, said opening of said stem connecting member and said opening of said stem are connected to said liquid induction hole.

A pressure sensor comprising:

• a housing having a fluid induction hole, said induction hole having an opening to an inner area of said housing, said housing further having an annular protrusion surrounding a periphery of said opening of said hole;
• a semiconductor pressure sensing element for sensing pressure;
• a mounting member for airtightly mounting said pressure sensing element;
• and
• a stem being airtightly fixed to said mounting member and to a top surface of said annular protrusion of said housing,
• wherein each of said mounting member and said stem defines a hole connected to said induction hole of said housing.

A pressure sensor comprising:

• a housing defining an inner area and an outer area of said pressure sensor, said housing having a liquid induction portion having a liquid induction hole connecting said inner area and said outer area of said housing, said liquid induction hole having an opening to said inner area of said housing,
• a semiconductor pressure sensing element positioned in said inner area of said housing for sensing pressure,
• a mounting member for airtightly mounting said pressure sensing element;
• and
• a stem for airtightly mounting said mounting member,
• wherein
• an annular protrusion is formed on said housing surrounding a periphery of said opening of said liquid induction hole,
• said stem is airtightly fixed on a top surface of said protrusion, and
• each of said mounting member and said stem has an opening defining a hole connected to said liquid induction hole.

A pressure sensor comprising:

• a housing having a fluid induction hole, said induction hole having an opening to an inner area of said housing, said housing further having an annular protrusion surrounding a periphery of said opening of said hole;
• a semiconductor pressure sensing element for sensing pressure;
• and
• a stem having an opening, said opening of said stem being connected to said opening of said induction hole, said stem being airtightly fixed on a top surface of said annular protrusion of said housing, and said semiconductor pressure sensing element being mounted on said stem.