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US 6,186,008 B1Granted
Semiconductor sensor component
AssigneeSiemens Aktiengesellschaft
InventorsThies Janczek, Bernd Stadler, Detlef Houdeau
Life of this patent
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Abstract
A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. The cover is directly set on the base body of the housing and contains a membrane and/or labyrinth.
Claims16
A semiconductor sensor component, comprising:
- a semiconductor body having both a sensor and an evaluation logic circuit formed in an integrated manner;
- an encapsulating component formed by a molding process of an electrically insulating material enclosing at least partially said semiconductor body and providing said semiconductor body with mechanical protection, said encapsulating component, including:
- a main case body having edges for housing said semiconductor body;
- a lid having a main lid body with edges and a through opening formed therein, said lid setting directly on said main case body such that said edges of said main lid body lying against said edges of said main case body;
- and
- a protective device disposed on said main lid body of said lid for closing said lid, said protective device being permeable to a medium to be sensed via said through opening, said protective device acting as a shield against mechanical stresses and having at least one of a membrane interrupting said through opening and a labyrinth having several winding passages leading to said through opening.
3 more elements
A process for fabricating a semiconductor sensor component, which comprises:
- providing a semiconductor body having both a sensor and an evaluation logic circuit formed in an integrated manner;
- and
- molding an encapsulating component formed of an electrically insulating material for enclosing at least partially the semiconductor body and for providing the semiconductor body with mechanical protection, the encapsulating component, further comprises:
- forming a main case body having edges for housing the semiconductor body;
- forming a lid having a main lid body with edges and a through opening formed therein, the lid setting directly on the main case body such that the edges of the main lid body lie against the edges of the main case body;
- forming a protective device disposed on the main lid body of the lid for closing the lid, the protective device being permeable to a medium to be sensed via the through opening, the protective device acting as a shield against mechanical stresses and having at least one of a membrane interrupting the through opening and a labyrinth having several winding passages leading to the through opening;
- delivering the main case body on a first assembly line to a final work station;
- and
- delivering the lid on a second separate assembly line to the final work station where the main case body and the lid are combined with each other.
6 more elements
Dependencies are inferred from the claim text.