Alignment method
AssigneeLucent Technologies Inc.
InventorsJoseph M. Freund, George J. Przybylek, Dennis M. Romero
Life of this patent
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Abstract
A system for handling semiconductor workpieces, by aligning a movable pick and place device and a movable optical control device, is disclosed. The system and method provide for the formation of an imprint by the pick and place device. The optical control device can then be aligned to that imprint, creating alignment between the pick and place device and the optical control device. Once alignment is complete the imprinted material may be replaced with one or more semiconductor workpieces. The system provides precise, repeatable alignment between the pickup point for the pick and place device and the optical control device.
Claims11
A method of aligning an optical device, said method comprising steps of:
- moving a pick and place device to a first position above an attach position on a film layer;
- using said pick and place device to form an imprint in the film layer, such that said imprint indicates said attach position;
- subsequently, moving said pick and place device to a second position;
- aligning an optical device to said imprint;
- and
- returning said pick and place device to said attach position.
A method of handling a semiconductor product, said method comprising steps of:
- moving a vacuum collet to a first position between a vision camera and a film layer, where said first position is above an attach position on said film layer;
- using said vacuum collet to form an imprint in the film layer, such that said imprint indicates said attach position on a semiconductor workpiece;
- subsequently, moving said vacuum collet to a second position;
- aligning said vision camera to said imprint;
- removing said film layer;
- placing a semiconductor workpiece in a place of said film layer;
- and
- using said vacuum collet to move said semiconductor product to a desired location.
Dependencies are inferred from the claim text.