Method to accurately determine classification codes for defects during semiconductor manufacturing
AssigneeAdvanced Micro Devices, Inc.
InventorsPaul J. Steffan, Ming Chun Chen
Life of this patent
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Abstract
A method of determining classification codes for defects occurring in semiconductor processes comparing images of defects from a first selected wafer with images of defects in a first image reference library. The images in the first image reference library are updated from a master image reference library. The images in the master image reference library are the best images of defect types. The images in the master image reference library are in a format readable by all review stations utilized to review the images of the defect.
Claims4
A method of determining classification codes for defects occurring in semiconductor manufacturing processes, the method comprising:
- sending a production lot of wafers through a first manufacturing process;
- scanning a selected wafer from the production lot in a first inspection tool to identify defects on the selected wafer;
- selecting defects from the identified defects on the selected wafer to review;
- forming images of the selected defects on the selected wafer;
- comparing the images of the selected defects on the selected wafer with defect images formed of defects previously identified in the first inspection tool and stored in a first image reference library;
- and
- determining a classification code for each selected defect on the selected wafer based upon the comparison of the images of the selected defects on the selected wafer with the defect images stored in the first image reference library.
Dependencies are inferred from the claim text.