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AssigneeInternational Business Machines Corporation
InventorsCharles N. Archie, Eric P. Solecky
Estimating the term…
A method determining the status of a feature (e.g., a semiconductor contact hole or trench) using a measurement imaging tool such as a scanning electron microscope (SEM). The method first assures that the waveform signal obtained from the SEM is reliable. A blanked beam signal, provided in saved images from the SEM, is the basis for a signal quality factor. This signal is provided in the waveform analyzed by the system. The method then analyzes all of the data between the edges of the feature and fits various functions to the data to determine which provides the best fit. Multiple linear regression and the r2 (quality of fit) factor, or some other type of correlation coefficient, are used to determine which function has the best fit. The feature is then characterized based on the particular function chosen and on the correlation factor obtained. The method of the present invention provides information which can be used to determine the line width or diameter measurement of the feature and whether the feature is open or closed.
A method for monitoring a process in which a feature is formed on a substrate, the method comprising the steps of:
A method for monitoring a process in which a feature is formed on a substrate, the method comprising the steps of:
A method for monitoring a semiconductor manufacturing process in which a feature such as a contact hole or trench is formed on a substrate, the method comprising the steps of:
Dependencies are inferred from the claim text.