Heat transfer device

A method for dissipating heat from a CPU in a computer case, comprising the steps of:

• providing a heat conductive base forming a first and a second cylindrical chambers aligned with each other, said first and second cylindrical chambers defining first and second openings opened to an exterior space on opposite sides of the heat conductive base respectively;
• providing a first heat conduction pipe having an end extending into and secured within the first cylindrical chamber of the heat conductive base and another end absorbing heat;
• providing a second heat conduction pipe having an end extending into and pivotally received in the second cylindrical chamber of the heat conductive base for absorbing heat from the first conductive pipe;
• and
• providing a heat-conductive lubricant in said second cylindrical chamber such that said second heat conduction pipe is substantially surrounded by said lubricant thereby increasing heat-transfer between said heat conductive base and said second heat conduction pipe.

A beat transfer device assembly for transferring heat generated from a CPU within a computer case to a monitor pivotally externally mounted to said computer case, comprising:

• a base;
• a first heat conduction pipe defining thereof a first end and a second end positioned around the base;
• and
• a second heat conduction pipe defining thereof a first end and a second end pivotally positioned around the base;
• wherein said second end of the first heat conduction pipe is very close to the second end of the second heat conduction pipe, and heat exchange occurs therebetween;
• wherein a heat conductive lubricant is filled between said second end of said second heat conduction pipe and said base.