Electronic circuit apparatus and method for assembling the same
AssigneeDenso Corporation
InventorsToru Itabashi, Toshiaki Yagura, Kazuya Sanada, Yukihide Niimi
Life of this patent
Estimating the term…
Abstract
A plurality of ceramic circuit boards mounted with heat-generative driving transistors and other electronic parts are bonded to a heat radiating fin, and the heat radiating fin is connected to a motherboard. Heat generated by the driving transistors can efficiently be absorbed and dissipated by the heat radiating fin, and assembling work necessary for combining the components to the motherboard can be reduced. The electronic parts, wiring patterns and the like on the circuit boards can simultaneously be encapsulated in a resin or the like after bonding the circuit boards to the heat radiating fin, packaging work can be reduced.
Claims17
An electronic circuit apparatus comprising:
- a case having an opening;
- a plurality of circuit boards mounted with a plurality of electronic parts including heat-generative electronic parts;
- a heat radiating member joined to the circuit boards to absorb and radiate heat generated by the heat-generative electronic parts, said heat radiating member being arranged in heat conductive relation with respect to said case such that the heat radiating member transfers the heat generated by said heat-generative electronic parts to said case;
- and
- a motherboard electrically connected to the circuit boards and fixedly holding the heat radiating member;
- a connector unit mounted in the opening of said case;
- wherein the heat radiating member is disposed adjacent to the connector unit in said case with said plurality of circuit boards being disposed on a side of said heat radiating member opposite the connector unit.
An electronic circuit apparatus comprising:
- circuit boards mounted with a plurality of electronic parts including heat-generative electronic parts;
- a motherboard to which the circuit boards are connected electrically in a vertical position;
- and
- a case covering the motherboard, the case having walls projecting from the case toward the motherboard in parallel with the circuit boards to form an opening therebetween and to surround at least a part of an area in which the electronic parts are disposed,
- wherein spaces between the circuit boards and the walls are filled with a heat-conductive resin.
An electronic circuit apparatus comprising:
- circuit boards mounted with a plurality of electronic parts including heat-generative electronic parts;
- a motherboard to which the circuit boards are connected electrically in a vertical position;
- and
- a case covering the motherboard, the case having walls projecting from the case toward the motherboard in parallel with the circuit boards to form an opening therebetween and to surround at least a part of an area in which the electronic parts are disposed,
- wherein a heat-conductive elastic member is inserted in spaces between the circuit boards and the walls.
A method for assembling an electronic circuit apparatus comprising:
- bonding a plurality of circuit boards mounted with a plurality of electronic parts including heat-generative electronic parts to a heat radiating member with an adhesive having a high thermal conductivity;
- filling a fluidic resin between a pair of walls of a case;
- inserting the heat radiating member with the circuit boards thereon into the fluidic resin;
- and
- joining the heat radiating member to a motherboard.
An electronic circuit apparatus comprising:
- a plurality of circuit boards mounted with a plurality of electronics parts including heat-generative electronic parts;
- a heat radiating member joined to the circuit boards to absorb and radiate heat generated by the electronic parts;
- a motherboard electronically connected to the circuit boards and fixedly holding the heat radiating member;
- and
- a case containing the motherboard therein, said case being set in heat conductive relation with the heat radiating member to transfer heat generated by the electronic parts through the heat radiating member;
- and
- walls projecting toward the motherboard to form an opening therebetween and surrounding at least a part of an area in which the electronic parts are disposed;
- wherein spaces between the circuit boards and the walls are filed with a heat conductive resin.
An electronic circuit apparatus comprising:
- a plurality of circuit boards mounted with a plurality of electronics parts including heat-generative electronic parts;
- a heat radiating member joined to the circuit boards to absorb and radiate heat generated by the electronic parts;
- a motherboard electronically connected to the circuit boards and fixedly holding the heat radiating member;
- and
- a case containing the motherboard therein, said case being set in heat conductive relation with the heat radiating member to transfer heat generated by the electronic parts through the heat radiating member;
- and
- walls projecting toward the motherboard to form an opening therebetween and surrounding at least a part of an area in which the electronic parts are disposed;
- a heat-conductive elastic member is inserted in spaces between the circuit boards and the walls.
Dependencies are inferred from the claim text.