A process for making a multilayer ceramic chip capacitor comprising alternately stacked, fired dielectric layers and internal electrode layers, wherein the dielectric layers are formed from a dielectric material comprising barium titanate as a major component and calcium titanate, barium oxide or a precursor thereof, calcium oxide or a precursor thereof, strontium oxide or a precursor thereof, silicon dioxide or a precursor thereof, manganese dioxide or a precursor thereof, yttrium oxide or a precursor thereof, and cobalt oxide or a precursor thereof as minor components in such proportions that there are present:
- BaTiO3:
- 94 to 99 mol %;
- CaTiO3:
- 0.1 to 4 mol %;
- BaO:
- 0.1 to 2 mol %;
- CaO:
- 0 to 1 mol %;
- SrO:
- 0 to 1 mol %;
- SiO2:
- 0.1 to 5 mol %;
- MnO2:
- 0.01 to 2 mol %;
- Y2O3:
- 0.1 to 3 mol %;
- and
- CoO:
- 0.01 to 1 mol %;
- wherein the dielectric material is free of magnesium oxide, the process comprising:
- (a) forming a green chip by stacking alternating layers of said dielectric material and an internal electrode material;
- and
- (b) firing the green chip to form a multilayer ceramic chip capacitor.