Semiconductor device and method for producing the same
AssigneeNEC Corporation
InventorsAkira Fujita, Choei Sugitani
Life of this patent
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Abstract
An interterminal anti-short-circuiting pattern is formed in an upper metal wire included in a connection terminal 3, for connecting to external driving LSI and the like, located on the projected portion of a bottom glass substrate 2. This pattern includes recess 4 and island 5 on which a contact hole 12a is formed through a protective insulating film. The protective insulating film has high residence to water penetration. Spread of the corrosion can be shut off by the recess surrounding the island. Short circuit occurrence due to interterminal current leak can be inhibited under high moisture conditions in the semiconductor device used for active matrix display, e.g. LCD panel.
Claims5
A semiconductor device, comprising plural lines of metal wires formed on a substrate each having a connection terminal positioned at the end of said substrate for connecting to an external driving circuit for applying voltage independently to every pixel electrode:
- wherein each of said metal wires at the position of said connection terminal is provided with an interterminal anti-short-circuiting pattern comprising conductive island and recess(es) located around said island;
- wherein the surface of said metal wire except at least a portion of said island but including the inside of said recess(es) thereon are covered with a protective insulating film;
- wherein a contact hole is formed of the uncovered portion with said protective insulating film on said island;
- and
- wherein a transparent conductive film is deposited on the surface of said protective insulating film and inside said contact hole including the top face of said island.
A semiconductor device, comprising plural lines of metal wires formed on a substrate each having a connection terminal positioned at the end of said substrate for connecting to an external driving circuit for applying voltage independently to every pixel electrode:
- wherein each of said metal wires at the position of said connection terminal comprises an upper metal wire and a lower metal wire, with an interlaminer insulating film being interposed between said substrate and said lower metal wire;
- wherein an interterminal anti-short-circuiting pattern comprising conductive island and recess(es) located around said island is provided at the same position of said upper and lower metal wires;
- wherein the surface of said metal wire except at least a portion of said island but including the inside of said recess thereon is covered with a protective insulating film;
- wherein contact hole is formed of the uncovered portion with said protective insulating film on said island;
- and
- wherein a transparent conductive film is deposited on the surface of said protective insulating film including inside said contact hole and the top face of said island.
Dependencies are inferred from the claim text.