Circuit connection structure

A tape carrier package structure comprising:

• a flexible film,
• a semiconductor device mounted on the film,
• a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to, outputting signals from, or both inputting signals to and outputting signals from the semiconductor device,
• a second conductor pattern formed in a region not provided with the first conductor pattern on the film in a state substantially free from signal supply to or from the semiconductor device,
• wherein the second conductor pattern is formed in a planar island shape, and
• a third conductor pattern provided on the second conductor pattern with an insulating layer sandwiched between the second and third conductor patterns.

A tape carrier package structure having two major surfaces comprising:

• a flexible film,
• a semiconductor device mounted on the film,
• a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to, outputting signals from, or both inputting signals to and outputting signals from the semiconductor device,
• a second conductor pattern formed in a region not provided with the first conductor pattern on the film in a state substantially free from signal supply to or from the semiconductor device,
• wherein at least a portion of at least one of the two major surfaces is blackened by application of a black-colored coating to provide a surface emission factor larger than 0.95.

A circuit connection structure comprising:

• a circuit board, and
• a tape carrier package structure, wherein
• (A) the tape carrier package structure comprises:
• a flexible film,
• a semiconductor device mounted on the film,
• a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to, outputting signals from, or both inputting signals to and outputting signals from the semiconductor device, and
• a second conductor pattern formed in a region not provided with the first conductor pattern on the film in a state substantially free from signal supply to or from the semiconductor device,
• wherein the second conductor pattern is formed in a planar island shape and
• (B) the tape carrier package structure is mounted on the circuit board via the first conduct or pattern.

A circuit connection structure comprising:

• a circuit board, and
• a tape carrier package structure, wherein
• (A) the tape carrier package structure comprises:
• a flexible film,
• a semiconductor device mounted on the film,
• a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to, outputting signals from, or both inputting signals to and outputting signals from the semiconductor device, and
• a second conductor pattern formed in a region not provided with the first conductor pattern on the film in a state substantially free from signal supply to or from the semiconductor device,
• wherein the second conductor pattern is formed in a planar island shape and
• wherein the second conductor pattern is physically connected to the semiconductor device and
• (B) the tape carrier package structure is mounted on the circuit board via the first conductor pattern.

A circuit connection structure comprising:

• a circuit board, and
• a tape carrier package structure, wherein
• (A) the tape carrier package structure has two major surfaces and comprises:
• a flexible film,
• a semiconductor device mounted on the film,
• a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to, outputting signals from, or both inputting signals to and outputting signals from the semiconductor device,
• a second conductor pattern formed in a region not provided with the first conductor pattern on the film in a state substantially free from signal supply to or from the semiconductor device,
• wherein at least a portion of at least one of the two major surfaces is blackened by application of a black-colored coating to provide a surface emission factor larger than 0.95, and
• (B) the tape carrier package structure is mounted on the circuit board via the first conductor pattern.