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US 6,184,773 B2Granted
Rugged fluid flow and property microsensor
AssigneeHoneywell Inc.
InventorsUlrich Bonne, Aravind Padmanabhan
Life of this patent
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Abstract
A thermal fluid flow or property sensor having no exposed contact wires or contact pads in the fluid flow path to obstruct measurements, flat fully passivated sensor surfaces and high corrosion resistance is implemented over a honeycombed thermal isolation chamber.
Claims22
A thermal fluid sensor comprising:
- a silicon microsensor die having a body with
- a) top and bottom surfaces and
- b) a central honeycombed portion extending between said top and bottom surfaces;
- and
- c) a sensor overlaying said honeycomb portion.
2 more elements
A thermal fluid sensor comprising:
- a silicon microsensor die having a body with
- a) top and bottom die surfaces and
- b) through-hole vias therein and
- c) a central void
- d) a first passivation/structural layer adhered to the top and bottom surfaces and the through-hole via walls;
- e) a second passivation/structural layer covering the first layer where it covers the top & bottom surfaces;
- f) a micromembrane heater/sensor overlaying the vias and the second layer of the top surface and being located substantially over the central void;
- g) the via first layer covering being plated with an electrical conductor, the electrical conductor extending to the heater/sensor at the top surface and covering, or extending beyond, the second layeron the bottom surface;
- h) bonding material covering portions of the second layer on the bottom surface;
- and
- i) a third layer of passivation/insulation material covering the heater/sensor and portions of the second layer and serving as a substantially planar top cap for the die.
8 more elements
A thermal fluid sensor comprising
- a silicon microsensor die having a body with
- a) top and bottom die surfaces and
- b) through-hole vias therein extending between said top and bottom surfaces, and
- c) a central honeycombed portion therethrough;
- d) a first layer of silicon dioxide adhered to the top and bottom surfaces, the top surface of the honeycombed portion, and the through-hole walls;
- e) a second layer of silicon nitride covering the first layer where it covers the top & bottom surfaces, including the top, but not the bottom, surface of the honeycombed portion;
- f) a platinum heater/sensor overlaying the vias and the second layer of the top surface and being located substantially over said honeycomb portion;
- g) the via first layer covering being plated with an electrical conductor, the electrical conductor extending to the heater/sensor at the top surface and covering, or extending beyond, the second layer on the bottom surface;
- h) thermocompression bonding material covering major portions of the second layer covering the bottom surface discontinuous with the via electrical conductor material at the bottom surface;
- and
- i) a third layer of nitride covering the heater sensor and portions of the second layer and serving as a substantially planar top cap for the die.
8 more elements
Dependencies are inferred from the claim text.