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US 6,184,579 B2Granted
Double-sided electronic device
AssigneeR-Amtech International, Inc.
InventorYuriy Dmitrievich Sasov
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AssigneeR-Amtech International, Inc.
InventorYuriy Dmitrievich Sasov
Estimating the term…
A double-sided electronic device includes a heat conductive substrate having working zones of structures and components disposed thereon in double planar arrangement, as a monolithic or hybrid electronic device. In order to connect the structures or components, disposed on different sides of a substrate, connecting conductors go through the substrate's edges. At the same time the connecting conductors are insulated from the structures and pass on main surfaces of double-sided electronic device. In a case of failure detection after burn-in and checking, the device having one good side is used as conventional, housed in a package or three-dimensional module. A device having two good surfaces has double information capacity. The invention provides a large economic benefit due to economy of materials and significantly increases a packing density of electronic equipment.
Double-sided electronic device comprising a heat-conductive substrate formed as a plate, there being semi-conductor structures and other electronic components mounted on each of opposite sides of the heat-conductive substrate, wherein there is at least one common connecting bonding pad disposed at a peripheral edge of the heat conducting substrate, said common connecting bonding pad being electrically coupled to electrical components on both sides of the heat-conductive substrate, said common connecting bonding pad including a conductive portion rounding a peripheral edge on the monolithic heat-conductive substrate.
Dependencies are inferred from the claim text.