Electronic component parts device

An electronic component part device having a packaging substrate and has at least one electronic component part mounted on the packaging substrate;

• said electronic component part having a connecting electrode on the side coming into contact with the packaging substrate;
• said packaging substrate having, on its surface, a connecting electrode terminal corresponding to the connecting electrodes of the electronic component part to be mounted;
• and
• said electronic component part being so provided that it is mounted on the connecting electrode terminal at the mounting position on the surface of the packaging substrate, with its own connecting electrode correspondingly to the connecting electrode terminal, the face of the electronic component part on which the connecting electrode have been formed and the surface of the packaging substrate are fastened by bonding through an adhesive, and the connecting electrode terminal of the substrate and the connecting electrode of the electronic component part are electrically interconnected;
• wherein;
• said packaging substrate comprises;
• a plurality of insulating layers;
• a plurality of wiring layers provided between the insulating layers;
• and
• a conductor provided in such a way that it passes through at least one constituting layer of the insulating layers, in order to electrically interconnect predetermined layers among the wiring layers;
• said plurality of insulating layers having;
• at least one first insulating layer containing of a resin;
• and
• as an outermost layer, a second insulating layer which constitutes one layer at least on the side where the electronic component part is fastened by bonding;
• said first insulating layer having a storage elastic modulus represented by E1, as measured by the DVE method, and the second insulating layer having a storage elastic modulus represented by E2, as measured by the DVE method, which are;
• E2=0.01E1 to 0.5E1.