Photosemiconductor device mounted structure
AssigneeNEC Corporation
InventorMotoyoshi Kawai
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Abstract
A photosemiconductor device mounted structure includes a plurality of tapered projections, a photosemiconductor device, second Au electrodes, and AuSn solder. The tapered projections are formed on a surface of an Si substrate. The photosemiconductor device has first Au electrodes. The second Au electrodes are formed on the tapered projections to correspond to the first Au electrodes. The AuSn solder bonds the first and second Au electrodes to each other.
Claims7
A semiconductor device mounting structure comprising a plurality of elastically deformable projections formed on a surface of a substrate,
- each of said plurality of elastically deformable projections having a conductive contact in registration with a corresponding electrode of the semiconductor device,
- said plurality of elastically deformable projections absorbing heat from the semiconductor device and elastically deforming so as to reduce a residual stress in the semiconductor device during use at the time of soldering the semiconductor to said substrate.
A structure for mounting a semiconductor device, the structure comprising a plurality of projections extending from a substrate in a first direction, wherein each of said plurality of projections has a conductive layer comprising a solder for contacting a corresponding electrode of the semiconductor device, and wherein each of said plurality of projections has a height and width above said substrate so that each of said projections is designed and adapted to flex in a second direction perpendicular to the first direction to compensate for heat-induced expansion differences between said substrate and the semiconductor device during use.
Dependencies are inferred from the claim text.