Vertical diffusion bonding apparatus
AssigneeDaido Tokushuko Kabushiki Kaisha
InventorMasaki Tsuchiya
Life of this patent
Estimating the term…
Abstract
A vertical diffusion bonding apparatus is provided with a lower block, a pressurizing jig which is fitted to a metal pipe supplied from an upper position, and a pressurizing mechanisms stood erect on the lower block. The lower metal pipe is held by the lower block and the pressurizing jig bonded to the metal pipe is attracted toward the lower block by using the pressurizing mechanisms. Thus, the metal pipe which is supplied from an upper position is pressed against the lower metal pipe.
Claims4
A vertical diffusion bonding apparatus wherein metal pipes are supplied from an upper position to a lower position, said vertical diffusion bonding apparatus comprising:
- a lower block (42) for holding a lower metal pipe at a lower position;
- a pressurizing jig (46, 48) attachable to an upper metal pipe supplied from an upper position, the pressurizing jig being supported solely by the lower block and further wherein said pressurizing jig and lower block are horizontally movable while the pressurizing jig is attached to an upper metal pipe, and
- a pressurizing mechanism provided on said lower block arranged so as to engage and draw said pressurizing jig toward said lower block while the pressurizing jig is attached to an upper metal pipe.
Dependencies are inferred from the claim text.